Reflow

The reflow process is where the solder paste, component placement and material selection come together with heat to produce finished solder joints on the entire assembly. An accurate and consistent thermal profile that properly activates the flux and heats the PCB and components thoroughly in order to melt the solder insures quality on every joint. Using our extensive experience in reflow solder process characterization, Ascentec Engineering designs light weight, thermally friendly process carriers. In many cases our customers do not need to change their profile or conveyor speed when converting to our process carriers.

Please contact us for more details.