The following lists the desired information that Ascentec Engineering will use to design your fixtures and tooling. The desired data differs depending on the product being designed. Please reference the Data Formats section to determine the best format for sending your data.

Wave Solder / Selective Solder Pallet
Desired Information	Purpose / Comment
Bottom-side silkscreen	Usually a good source of component outlines.
Bottom-side mask	Indicates which metal areas are masked and which are exposed
Bottom-side paste	Used to determine which parts are added during the SMT process.
Top-side silkscreen	Allows for correct position of holddowns, and indicates parts that overhang the image edge.
Top-side paste	(optional)
Top-side mask	(optional)
Fabrication Drawing	The dimensioned fabrication or panel drawing if panelized during wave. Also contains valuable information including: PCB dimensions and thickness, layer stack-up, and board chemistry (substrate, plating, and mask types).
Additional Information	Components that overhang the pcb edge: comp height, depth below pcb and overhang distance. Mounting hardware size/location. Height of components requiring connector hold downs.

Surface Mount
Desired Information	Purpose / Comment
Bottom-side silkscreen	Usually a good source of component outlines.
Bottom-side mask
Bottom-side paste	Used to determine which parts are added during the SMT process.
Top-side silkscreen	Usually a good source of component outlines.
Top-side paste	Used to determine which parts are added during the SMT process.
Top-side mask
Fabrication Drawing	The dimensioned fabrication or panel drawing shows the panel layout and contains valuable information including: PCB dimensions and thickness, layer stack-up, and board chemistry (substrate, plating, and mask types).
Drill Data	Gives the designer tooling hole information for correct placement of tooling pins.

Press-fit Tooling Plates
Desired Information		Purpose / Comment
Bottom-side silkscreen	Needed if pressed component presses from Top-side	Used to design clearance for bottom-side components.
Bottom-side mask
Bottom-side paste
Top-side silkscreen	Needed if pressed component presses from Bottom-side	Used to design clearance for Top-side components.
Top-side paste
Top-side mask
Fabrication Drawing		The dimensioned fabrication or panel drawing shows the panel layout and PCB dimensions and thickness.
Drill Data		Gives the designer tooling hole information for correct placement of tooling pins, and defines hole sizes for the pressed components.

Print Plates
Desired Information		Purpose / Comment
Bottom-side silkscreen	Needed bottom-side is processed first (usually the case).	Used to design clearance for bottom-side components.
Bottom-side mask
Bottom-side paste
Top-side silkscreen	Needed if top-side is processed first.	Used to design clearance for Top-side components.
Top-side paste
Top-side mask
Fabrication Drawing		The dimensioned fabrication or panel drawing shows the panel layout and PCB dimensions and thickness.

Router Plates
Desired Information	Purpose / Comment
Top-side silkscreen	Used to design clearance for Top-side components.
Top-side paste
Top-side mask
Fabrication Drawing	The dimensioned fabrication or panel drawing shows the panel layout and PCB dimensions and thickness.
Drill Data	Gives the designer tooling hole information for correct placement of tooling pins.